“In the 5G era,
ceramic substrates are game changers”
Herald Economy, 2023.07.04
01
Nano Energy thesis
for flexible devices
02
Highly stacked and complex shape precision parts for 5G
(base stations and mobile device antenna modules)
The stacked antenna for 5G has a 14-layer stacked structure, and since the frequency used is 28GHz, substrate materials with low permittivity and low loss coefficient are required. Therefore, it is a product that can be easily manufactured by utilizing the mass production technology of the ink manufacturing and inkjet printing process developed in this project and the flip hip packaging manufacturing technology. Compared to production by other processes such as existing PCB build-up and ceramic lamination sintering, it is advantageous in many aspects such as initial investment, electrical characteristics, process and production cost.
03
Thin layer and complex shape heat dissipation module
(MCCL module, heat dissipation module for display and lighting)
Compared to other technologies such as MCCL (Metal PCB) and DBC (Direct Bonded Copper), the module using the heat dissipation characteristics of the ceramic hybrid layer is inkjet printing without photolithography, which is a circuit formation process, saving 40% of initial investment and 38% compared to photolithography It is a technology that can reduce the process time and production cost by 50% or less. The global market for heat dissipation materials based on new materials is forming a large market of US $ 4.5B in 2020, and growth of 6% is expected in the future
04
Manufacture of ultra-small FC BGA of GaN chip for 5G
The existing flip chip BGA manufacturing process consists of electrode formation by plating and lamination using ccl. Therefore, by using the low dielectric constant and low loss ceramic hybrid material of this project, a three-dimensional structure of SR (solder resist) and electrodes between the chip (die) and the bump solder is formed, a multilayer structure of an interposer (carrier) is formed, and a multilayer structure To contribute to the production of the world's smallest GaN chip by developing the embedded passive element SMD within the device. This development is being carried out as an investment-linked material parts equipment development project (Ministry of Industry and Trade), and has secured more than 3 billion won for R&D for 2.5 years and is in progress.
Early Startup Package
(Ministry of SMEs and Startups
/ Institute for Startup Promotion)
19.06 ~ 20.01
Heat dissipation module using ceramic hybrid material-based inkjet single process
120.06 ~ 21.01
Ceramic high-fill hybrid for self-power generation for wireless sensor networks by inkjet printing
Industry-university cooperation Collabo.
(Ministry of SMEs and Startups/Small and Medium Business Technology Information Agency)
TIPS/TIPS linked business
(Ministry of SMEs and Startups/Small and Medium Business Technology Information Agency)
20.06 ~ 22.05/ 20.06 ~ 21.05/ 20.06 ~ 21.05
Unbreakable and flexible new ceramic material
21.06 ~ 23.12
Commercialization of high-functionality modules using ceramic hybrid materials for 5G and IoT smart environments
Material Parts Technology Development Project
(Ministry of Trade, Industry and Energy/Korea Evaluation Institute of Industrial Technology)